| 摘要 |
PURPOSE:To improve cooling efficiency and the efficiency of mounting by pressure-welding a film having elasticity and containing a liquid to the surface of an IC. CONSTITUTION:Cooling pipes 4 being in contact directly with the heat-dissipating surfaces of IC elements are mounted among printed substrates 2 on which ICs are loaded, and a cooling liquid 7 is flowed back. The cooling pipes are bonded and fixed to plates 3, consist of tough films such as a rubber, and are brought into contact along the surfaces of the IC elements by cooling hydraulic pressure, thus improving a heat dissipation effect. According to the constitution, the ICs having high power consumption can be cooled efficiently, and an IC device also having simple structure and high mounting efficiency is obtained. |
