发明名称 Surface mountable coefficient of expansion matching connector
摘要 A modular connector housing of relatively short length and having a coupling feature, such as a tab at one end and a recess at the other end, is connected with other similar connector housings. A filler material having a melting point lower than that of the particular soldering method chosen is then inserted into that portion where two housings are joined thereby forming a relatively rigid long connector housing. A hot-melt adhesive preform is then placed on the bottom of the connector housing with the entire connector housing assembly aligned with and attached to a printed circuit board. The hot-melt adhesive bonds the connector housing to the substrate while the filler material melts away from the filler openings, allowing the short incremental housing lengths to move relatively free with respect to each other.
申请公布号 US4550959(A) 申请公布日期 1985.11.05
申请号 US19840673222 申请日期 1984.11.20
申请人 AMP INCORPORATED 发明人 GRABBE, DIMITRY G.;KORSUNSKY, IOSIF
分类号 H05K3/30;(IPC1-7):H05K1/00;H01R13/504;H01R9/09 主分类号 H05K3/30
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