Apparatus for use in cooling integrated circuit chips

摘要

An integrated circuit chip is cooled by being mounted on a substrate which is urged into contact with a compliant mat which includes a layer having a predetermined array of interconnected metallic pads for spreading heat flux more uniformly. The mat is connected to a plate which may be water cooled. The mat also includes additional layers which are heat conductive and electrically insulative. One of the additional layers is a film of paste.