| 摘要 |
PURPOSE:To prevent mechanical damage applied on a semiconductor element by a method wherein the semiconductor element is positioned by being adsorbed with a through-hole provided at a required position of a fixing member, and is then brazed. CONSTITUTION:A heat sink 3A on which a submount 2A has been mounted is positioned by installation on a heater 4A. After a chip 1 is positioned by being mounted on the submount 2A, the chip 1 is fixed by adsorption to the submount 2A via through-holes 2B and 3B from the through-hole 4B of the heater 4A connected to a vacuum line. Next, adhesion is done by fusing the solder between the chip 1 and the submount 2A and that between the submount 2A and the heat sink 3A by heating the heater 4A. |
