| 摘要 |
PURPOSE:To perform excellent wire bonding even though noble metal plating is omitted, by implanting the ions of a specified element in the wire bonding part of the inner lead of a lead frame, whose surface is Cu or Fe. CONSTITUTION:In the wire bonding part of at least the inner lead of a lead frame, whose surface is Cu or Fe, at least one kind of Au, Ag, Pb, B, Al, rare earth elements and alkaline earth elements is implanted as ions to the concentration of 10<16>-10<19> ions/cm<2>. Then the wire bonding property is conspicuously improved. Even though noble metal plating is omitted at the wire bonding part, the excellent wire bonding can be performed of course in H2-N2 reducing atmosphere, and in an inactive atmosphere such as N2 and Ar, or furthermore in the air. |
