| 摘要 |
PURPOSE:To improve reliability and moisture resistance simultaneously by positioning the upper surface of a semiconductor chip and the upper surface of an inner lead in the same plane and positioning the center in the thickness direction of the semiconductor chip and the center of height of a package at approximately the same position. CONSTITUTION:The center of a chip 1 and the center of a package 2 are conformed (R1=R2) with each other, and the upper surfaces of inner leads 3 and the height of the surface of the chip 1 are made coincide. Since the upper surfaces of the inner leads and the height of the surface of the chip are shaped in the same plane in this manner, the short circuits with the chip of gold wires can be removed even when a resin material on a sealing process is injected at very high pressure, thus improving yield. Since the center of the chip 1 is positioned at the center of the package 2, the permeation time of water, which is transmitted in a resin and intrudes, can be lengthened. |
