发明名称 THERMALLY BONDING METHOD OF POLYSTYRENE FILM
摘要 PURPOSE:To manually bond the cover of a pack with body by holding a joint piece at temperature difference of 5-50 deg.C in the pack joining in a super-store, applying a load to a film and thermally bonding for regulated bonding time. CONSTITUTION:Temperature control knobs 29, 30 are set so that upper and lower joining pieces 17, 7 are at temperature difference of 15-50 deg.C at the prescribed temperature in such a manner that the temperature of the piece 17 is 215-220 deg.C and the piece 7 is 170-175 deg.C, and controlled while detecting by sensors 16, 6. When a polystyrene vessel to be bonded is placed on the piece 7, a motor 23 is driven by the operation of a microswitch, the piece 17 is moved down to thermally bond. Thus, the pack of the cover can be manually effectively bonded thermally with the body in a super-store, and simply bonded by a bonding machine.
申请公布号 JPS60217136(A) 申请公布日期 1985.10.30
申请号 JP19840074716 申请日期 1984.04.13
申请人 OOHASHI KIKAI SETSUKEI KK 发明人 OOHASHI HISAYOSHI
分类号 B29C65/02;B29C65/00;B29C65/18 主分类号 B29C65/02
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