| 摘要 |
<p>PURPOSE:To facilitate the release of wafers after dicing by a method wherein the liquid on the upper surface of a wafer is removed by spraying a gas to the upper surface before isolation of the wafer from an attraction table after dicing. CONSTITUTION:Since the wafer 1 is diced in the state of being cooled with a liquid such as water, it is very difficult to remove the wafer 1 adhered to a dicing table (attraction table) 21 with water, etc. from this table 21. Therefore, the liquid in the periphery of the wafer 1 should be eliminated by partly spraying air 25 through a tube 24 to the wafer 1 from obliquely above it. This manner can facilitate later processes such as release and enables the prevention of mechanicl damage to the wafer 1.</p> |
