发明名称 BONDING METHOD OF DIAMOND PARTS AND METAL MATERIAL AND ADVANCE WAVE PIPE OBTAINED BY UTILIZING SAID METHOD
摘要 A method for attaching a diamond component to metal is described, wherein a layer of brazing material is provided at the interface between the diamond and the metal. A laser is used for heating the brazing material. The laser beam is focussed through the diamond at least substantially on the interface between the diamond and the metal. In one aspect, the invention is utilized in the manufacture of a travelling wave tube having a metal helix disposed within the tube. Diamond support blocks are bonded between the inner walls of the tube and the windings of the helix according to the method of this invention.
申请公布号 JPS60216973(A) 申请公布日期 1985.10.30
申请号 JP19850053488 申请日期 1985.03.19
申请人 DE DORATSUKAA ANDO ZEETO ENU NV 发明人 PETERU KOERUTO FUAN BENNEKOMU;MIKAERU SUIIRU
分类号 C04B37/02;B23K1/00;B23K1/005;B23K26/00;B23K26/32;B23K31/02;B23P5/00;H01J23/06;H01J23/26 主分类号 C04B37/02
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