| 摘要 |
PURPOSE:To obtain printed circuit boards of high accuracy and full bendability by a method wherein IC holes and bending holes are bored in a flexible film with adhesive on the basis of carrier holes, and a wiring board is manufactured by using this film. CONSTITUTION:Carrier holes 5 are bored in a coat of adhesive on the flexible film 3 and in a lamination of protection film 1 thereon. Then, IC holes 4 and bending holes 18 are bored on the basis of this hole 5. Thereafter, a metal foil 6 serving as the conductor layer is laminated on the film 3 so as to cover the holes 4 and 18. Then, the adhesive 2 is cured by heating, and it is coated with an etching resist 7. A conductor circuit 8 is formed, and necessary parts are coated 9 by insulation. Afterwards, an IC10 is bonded and sealed with a molding agent 13. The whole is cut at parts of cutting lines 11. This manufacture can yield the titled circuits board serving also for IC bonding of high accuracy and full bendability. |
