发明名称 HEAT-TREATING METHOD
摘要 PURPOSE:To enable a required surface area and the depth of an object to be easily heated to a fixded temperature by a method wherein a surface area to be heated is scanned with a light beam with a wavelength and a light amount selected according to the heating temperature and the heating depth. CONSTITUTION:The Si substrate 1 having a film 11 of diffusion impurity source on the surface is placed in a reaction chamber 2, and N2 gas is introduced after evacuation of the chamber 2 by a vacuum pump 3. Then, a region of the substrate 1 where the impurity is to be reduced is scanned with a near infrared oscillated beam 5 of YAG laser incident onto the substrate 1. Thereby, the surface of the substrate is heated, and the impurity diffuses out of the film 11 into the substrate 1 only at the region irradiated with the beam. This manner enables only the required region to be heated to a fixed temperatue to a fixed depth by changing and controlling the light wavelength and the light amount.
申请公布号 JPS60216561(A) 申请公布日期 1985.10.30
申请号 JP19840073285 申请日期 1984.04.12
申请人 FUJI DENKI SOUGOU KENKYUSHO:KK 发明人 SAGA MISAO;SHIMIZU AKINORI;MATSUZAKI KAZUO
分类号 H01L29/78;H01L21/22;H01L21/26;H01L21/265;H01L21/324 主分类号 H01L29/78
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