| 摘要 |
PURPOSE:To prevent air bubbles from remaining in an outer casing by a method wherein the lower surface of a flange provided in the upper part of the outer casing is made inclined. CONSTITUTION:The lower surface of the flange 4.1 provided in the inside direction of the upper part of the outer casing 4 is inclined 4.4 at a positive angle of theta deg. toward the opening. Next, an insulation substrate 2 is fixed on a heat dissipating plate 1, and further a semiconductor element 3 is fixed above the substrate 2. Then, the outer casing 4 is loaded along the periphery of the heat dissipating plate 1, and is filled with sealing resin 6 through its upper opening, which resin is then cured, thereby, the inside is hermetically sealed. In other words, the air involved at the time of filling with the resin 6 and the gas evolving at the time of cure are spontaneously released out by the difference in specific gravity along the inclined surface 4.4 of the casing 4. This prevets the deterioration in characteristic and the breakdown of semiconductor elememt generating by the remaining of air bubbles 7 and make the facility cost and the processing cost inexpensive. |
