| 摘要 |
PURPOSE:To provide a device which permits exact and easy brazing and removing of a chip to and from the narrow part of a substrate by heating the substrate land by the two projecting parts at the tip of a soldering iron, brazing or disconnecting the chip part to or from said land and providing further a mechanism for sucking and depressing the chip. CONSTITUTION:The land 13 of a substrate 11 is pressed and heated by the two projecting parts 3 at the tip of the soldering iron and the chip part 01 is brazed to or disconnected from said land. A suction hole 4 and an ejecting bar 5 are provided to a coated surface 2 for preventing sticking of solder in the recess of the iron so that the chip part 01 is disposed into the prescribed position by the suction holding and the projection of the bar 5 pressed by a pressing plate 7. The soldering and removal of the chip part to and from the narrow part of the substrate 11 are made extremely exact and easy and the working efficiency is improved. |
