发明名称 THERMOSETTING PRESSURE-SENSITIVE ADHESIVE TAPE
摘要 PURPOSE:To provide the titled tape having excellent adhesivity and abrasion resistance, and adhesive to an adherend such as ceramic, glass, etc., by compounding a pressure-sensitive adhesive with a thermosetting resin powder having an average particle size and the hardness of cured product falling in specific respective ranges. CONSTITUTION:A pressure-sensitive adhesive is compounded with 5-90wt% (based on the solid component of the adhesive) thermosetting resin powder having an average particle size of 50-300 mesh and a hardness of cured product of 45-150 (Barcol hardness) and normally incompatible with the adhesive (e.g. powder of epoxy resin, phenolic resin, etc.). The obtained adhesive is applied to at least one surface of a substrate to obtain the objective pressure-sensitive tape.
申请公布号 JPS60217283(A) 申请公布日期 1985.10.30
申请号 JP19840070905 申请日期 1984.04.11
申请人 TERAOKA SEISAKUSHO:KK 发明人 KAWAGUCHI TAKEO
分类号 C09J7/02 主分类号 C09J7/02
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