发明名称 Shock absorbing transducer module
摘要 A modular transducer mounting arrangement includes a substantially planar support plate. An aperture having an angular bevel is provided in the support plate such that a loudspeaker may be positioned in the bevel to allow sound to exit from the loudspeaker in a manner which is substantially unobstructed acoustically. An adhesive shock absorbing pad is attached to the rear of the support plate for isolating the loudspeaker microphone and support plate from mechanical shock. This creates a free floating and reliable transducer mounting assembly which provides shock isolation and easy serviceability.
申请公布号 US4550429(A) 申请公布日期 1985.10.29
申请号 US19830500722 申请日期 1983.06.03
申请人 MOTOROLA, INC. 发明人 BURBANK, RAYMOND W.;MYERS, CHRISTOPHER A.
分类号 H04R1/02;(IPC1-7):H04R1/02 主分类号 H04R1/02
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