| 摘要 |
PURPOSE:To decrease the volume of each bump electrode to about one half and to reduce the usage of Au by a method wherein the bump electrodes, which are bonded on the point parts of the lead terminals, are respectively formed into a polygonal configuration, and the bump electrodes are mounted on the point parts of the lead terminals in such a way that one line of the diagonal lines of each bump electrode intersects orthogonally with the longitudinal direction of a lead terminal, which is junctioned with the bump electrode in a pair. CONSTITUTION:Bump electrodes 16 are formed on a substrate 7 and the pump electrodes 16 are transfer-bonded on the point parts of lead terminals 11 as indicated in the diagram (b). Provided that, the bump electrodes 16 shall be respectively one being formed in advance so that one line of the diagonal lines of each of the bump electrodes 16 intersects orthogonally with the longitudinal direction of a lead terminal 11, which is junctioned with a bump electrode 16 in a pair, and the width of the diagonal line is wider than that of the point part of the lead terminal 11. Then, the bump electrodes 16 transferred and bonded on the point parts of the lead terminals 11 are bonded on electrode parts 13 provided on an semiconductor element 12 by performing a thermocompression bonding as indicated in the diagram (c). |
