| 摘要 |
<p>PURPOSE:To obtain a chip carrier having excellent heat dissipation properties by bonding a semiconductor part with a cap and increasing the quantity of heat dissipation through the cap. CONSTITUTION:A semiconductor part 16 is loaded on a chip carrier body 11 in a face down manner. A stepped section 22 is formed to the inner surface of a cap 12 to which a heat sink 19 is mounted, and the chip carrier proper 11 is intruded up to the stepped section 22. When the chip carrier proper 11 on which the semiconductor part 16 is loaded is combined, the back of the semiconductor part 16 is brought into contact with the cap 12 by the stepped section 22. The back of the semiconductor part 16 and the cap 12 are bonded by adhesives 17 containing a substance such as Ag, and adhesives 18 having low viscosity are cured between the cap 12 and the chip carrier proper 11 to seal the semiconductor part 16. Heat generated from the semiconductor part is dissipated through the cap 12 and the heat sink 19 in the chip carrier.</p> |
