| 摘要 |
<p>PURPOSE:To obtain a chip carrier having excellent heat dissipation properties by loading a semiconductor part on the chip carrier in a face down manner, bringing the semiconductor part and a cap into contact and increasing the quantity of heat dissipation through the cap. CONSTITUTION:A semiconductor part 15 is placed on a chip carrier proper 11 in a face down manner, and leads 14 and pads 12 for the leads are connected through thermocompression bonding, etc. A plate-shaped cap 17 with a heat sink 18 is bonded with the back of the semiconductor part 15 by a resin such as Ag epoxy resin 16 so as to run parallel with the chip carrier proper 11. The semiconductor part 15 is pushed toward the chip carrier proper 11 at that time, and the leads 14 are deformed. A spacer 19 is inserted between the chip carrier peoper 11 and the cap 17, and a clearance between the chip carrier proper 11 and the cap 7 is widened and the leads 14 are restored. The spacer 19 is fixed while being sealed by adhesives 20. Heat generated from the semiconductor part 15 is dissipated through the cap 17 and the heat sink 18 in the chip carrier.</p> |
