| 摘要 |
PURPOSE:To obtain the chip bonding device which is excellent in respect of cost of equipment, occupation area and workability by a method wherein a plurality of chips are bonded using a bonding device. CONSTITUTION:A tape 37, wherein chips 36 will be placed, is wound around chip filling tape reels 35A, 35B.... The tape 37 consists of a chip filling tape 40, which is formed by adhering a main tape 39 on the lower surface of an auxiliary tapes 38 whereon holes 38a to be used to place the chips 36 are formed at regular intervals, and a cover tape 41. An X-Y table 12 moved in X-Y direction, a chip 36A is picked up by a chip collet 28, and a bonding process is performed by pressing the chip to the bonding agent coated at the point A of a substrate 3B. Simultaneously with the time when the chip is picked up, the chip 36A on the next filling tape 40 is sent to the pick-up position. Also, the cover tape 41 is rolled up on a cover tape reel, and the chip 36A on the tape 37 is exposed. The bonding of the chip 36A at the point A of the substrate 3B is now completed. |
