| 摘要 |
PURPOSE:To prevent the application of thermal stress to the whole semiconductor-device package owing to the partial heating only of connecting sections, to narrow the intervals of connecting pins and to connect the connecting pins positively to an electrode pad for the package by electrically welding the connecting pins to the electrode pad. CONSTITUTION:When a connecting pin 6 is connected to a semiconductor package 1 in which the connecting pin 6 is fitted onto the base of a pin-grid-array type, etc., the upper section of an electrode pad 2 connected to a section 5 for outer-circumferece plating through a via hole 3 and inner-layer putters 4, 4 in the package 1 is coated with a Ni layer as a welding intermediate layer 7, a connecting pin 6, which consists of a Fe alloy containing 42% Ni or a Fe alloy containing 29% Ni and 17% Co or the like and takes a plate shape and a lower end section thereof takes a conical shape, is pushed, and the upper end of the pin 6 and the terminal 5 for plating are connected and welded to an external power supply. Accordingly, only a welding section may be heated partially, thus positively welding the connecting pin to the electrode pad without applying thermal stress to the whole package. |
