| 摘要 |
PURPOSE:To improve the quality and the reliability by providing metallic plates between laminated synthetic resin plates constituting a package to prevent surely peeling phenomena of the layer-built structure which are generated at a resin forming time. CONSTITUTION:A metallic plate 2, a lower frame plate 4 where a conductor pattern 5 is formed on the surface, a metallic plate 6, and an upper frame plate 7 are arranged on a bottom plate 1 through an adhesive 3, and a lead wire 8 is arranged on the conductor pattern 5, and a magnetic bubble memory device 9 is arranged on the bottom plate 1. Since metallic plates 2 and 6 are arranged between the bottom plate 1 and frame plates 4 and 7 consisting of heat-resisting synthetic resin plates in this manner, distortion and deformation, which are generated when a resin for transfer mold is charged to the outside peripheral part of the package at a high temperature and a high pressure in the heating state, are absorbed to prevent surely peeling of the layer-built structure, and displacement of the attaching position of the memory device 9 or the like is prevented to make electric characteristics constant, and thus, the quality and the reliability are improved considerably. |
