| 摘要 |
PURPOSE:To reduce the lead path of a signal line connecting an IC chip easily by connecting directly the IC chip for an image element drive circuit and a video output amplifier circuit on a single substrate with the solid-state image pickup element. CONSTITUTION:When the IC chip 3 of the image pickup element drive circuit drives the solid-state image pickup element 2, the video image to be mode incident to the solid-state image pickup element 2 via a cover glass 6 is subject to photoelectric conversion and then amplified to a prescribed level by the IC chip 3 of the video output amplifier circuit. Since the solid-state image pickup element 2 is arranged on the substrate 1 not through a package, it is possible to narrower intervals l1, l2, l3 among the IC chips 3, 4 of the image pickup element drive circuit and the video output amplifier circuit and the solid-state image pickup element 2 and the length of lead patterns 1a, 1b is suppressed to a required minimum value. Thus, a signal transmitted among the solid-state image pickup element 2 and the IC chips 3, 4 is transmitted in a very proper state, that is, without deterioration of the S/N and generation of phenomen a of crosstalk, etc. |
