| 摘要 |
PURPOSE:To contrive to reduce the cost of a semiconductor device, on which a light irradiation is needed, by a method wherein the package part of the light irradiation surface over the pellet is at least formed with a light-transmitting resin. CONSTITUTION:A wire-bonding has been performed for electrically connecting a pellet 3 attached on a pellet attaching part 1 with such a bonding agent 2 as a silver paste, the electromagnetic pads 4 of this pellet 3 and lead terminals using wires 5 and a package is formed by molding the wires 5 and internal lead parts with a resin 6. This whole package has been formed using a polymethyl methacrylate (PMMA) of the nature of allowing to transmit sufficiently even an region of ultraviolet rays so long as the monochromatic light consisting the ultraviolet rays is a light of a wavelength of more than 270mmu (nm) as the resin 6. This semiconductor device can be easily manufactured in the same manufacturing method as that of an ordinary resin-sealed semiconductor device by replacing a resin only for molding with the PMMA. A low-priced light-transmitting resin is used as the material for this semiconductor device in such a manner, and moreover, the package can be molded in one body as one structural body. As a result, the manhour can be significantly reduced. |
