| 摘要 |
PURPOSE:To obtain high patterning accuracy by a method wherein patterning is carried out by grinding while thin films formed on the curved plane or three planes of square substrates are made continuous over two planes or more. CONSTITUTION:Substrates 1 and 1' required to be coated with a thin film are superposed on each other, both ends of which are then supported by substrate supporters 2, and, contained in a rotary jig 3, the substrates 1 and 1' are coated with thin films over three surfaces. Next, before patterning of thin film to a required shape, first the substrate 1 is taken out of the jig 3 and fixed on a substrate supporting base 4 on the non-patterned plane of the substrate 1 with an electron wax 5 of low melting point. Thereafter, the supporting base 4 is vacuum-chucked to a fixing base of a dicing saw 6, and the thin film coating the substrate 1 is patterned by grinding through movements of the saw 6. At this time, the grinding is carried out in the width direction and longitudinal direction of the surface of the substrate 1, and next similar grinding is carried out to side surfaces after another fixing of the substrate 1. |
