| 摘要 |
PURPOSE:To contrive the improvement in efficiency by a method wherein processes of holding resin-sealed type devices finished in leg-bending into the first holders of mono- array type, replacing them to the second holders of multi-array type, pre-treating them with solder plating, and then holding them again into the first holders are accomplished through full automation. CONSTITUTION:Resin-sealed type devices 2 finished in leg-bending with a press 51 are held into the hollow holders 4 of mono-array type on a table 52B by passing through a chute 52A, and are then replaced to the second holders 6 with a device 7. The device 6 has many pairs of rods 62 in parallel on a substrate 61, holds the device 2 so as to slide in the longitudinal direction, and is provided with a frame hang-down 63 on the one-end side. The holders 6 and 4 are placed at the end on the table plate 73 of the device 7. The inclination of the plate 73 is changed by a cylinder 71, and the devices are replaced through a chute 75 by control with a gate 76. The holders 6 fully filled are supplied to a series of automatic solder pre-treating devices, taken out, mounted on the table plate 73 with vacant holders 4, replaced to the holders 4, and then fed into the process of solder plating in unchanged state. This construction enables the pre- treatment of solder plating through full automation with high efficiency. |
