发明名称 CUTTING INSTRUMENT OF PLATE MATERIAL
摘要 PURPOSE:To cut a thick plate by irradiating a laser beam to a plate surface from the 1st nozzle nearly at right angles with the plate surface and by irradiating a laser beam to another surface of the plate from the 2nd nozzle at specified angle against a vertical axis with the plate material. CONSTITUTION:The 1st cutting nozzle 2a that a laser beam 6 is irradiatable nearly at right angles with the surface of a plate material 1 is disposed and the 2nd cutting nozzle 2b that a laser beam 6' is irradiatable at specified angle theta1 against the vertical axis with the plate material 1 to another surface thereof is disposed. The inclination angle theta of the cutting nozzle is adjusted within 90 deg.. Then the laser beam 6' is irradiated from the 2nd nozzle 2b and the plate material 1 is cut by welding from its end part with its moving to left, and at the same time the amount of a thickness t1 is cut by welding with the laser beam 6 irradiated from the 1st nozzle 2a and a whole plate thickness t0 is cut. A laser cutting of a thick plate is thus becomes possible.
申请公布号 JPS60210388(A) 申请公布日期 1985.10.22
申请号 JP19840067928 申请日期 1984.04.03
申请人 MITSUBISHI DENKI KK 发明人 NIIMI AKIHIKO
分类号 B23K26/00;B23K26/36;B23K26/38 主分类号 B23K26/00
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