| 摘要 |
PURPOSE:To simplify a process and to decrease manufacturing cost by making a bottom of IC chips abut on an insulated material having fluidity by burying the IC chips so that their upper faces may be exposed and by molding them as flat sheets in the surfaces. CONSTITUTION:A rectangular frame part which is the same shape and the same size as the actually chips-equipped substrate A of an IC card is installed on the outer circumference of a lower mold board 6. IC chips 2 and 3 are placed in fixed position on the lower mold board 6, a liquid insulated material 1' is poured into a mold, and a flat upper mold board is pressed on the upper surface at a little hardened stage to form a sheet with a fixed thickness. When the flat upper mold board is removed after that, the insulated board equipped with the IC chips in which the formed surfaces 2a and 3a of a conductor pattern of the IC chips 2 and 3 are arranged on the same level as the surface of the mold board can be obtained. Thereafter, the conductor pattern and input and output terminals are installed on the insulated board equipped with the IC chips to perform the fixed electric connection. |
