发明名称 |
Electroless copper deposition solution |
摘要 |
An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and alpha , alpha '-dipyridyl can give a deposited film with high elongation.
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申请公布号 |
US4548644(A) |
申请公布日期 |
1985.10.22 |
申请号 |
US19830535057 |
申请日期 |
1983.09.23 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
NAKASO, AKISHI;YAMANOI, KIYOSHI;OKAMURA, TOSHIRO;TSURU, YOSHIYUKI |
分类号 |
C23C18/40;(IPC1-7):C23C3/02 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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