| 摘要 |
PURPOSE:To decrease the number of terminal lead wires down to half and also to reduce heating value by providing a common conductor layer between insulated layers for gap. CONSTITUTION:A copper thin film excellent in both the conductivity and the heat conductivity is formed on a magnetic substrate 1 doubling a lower magnetic layer in the form of a bias current conductor layer 3 and a common conductor layer 10. Then a pierced hole for a magnetic connection part 6a which connects an upper magnetic layer 6 and the substrate 1 is provided together with a separating part 12 for the layer 10 which is used when a part of the layer 10 is used as the layer 3. An insulated layer 2 is formed on both layers 10 and 3 to obtain a magnetic gap part 19. Then only the pierced hole of the part 6a and then hole area of a conductor connection part 11 are removed for connection between the layer 6 and the substrate 1, and a winding conductor layer 4 is formed on the area where those holes are removed. In this case, a terminal lead wire 4bi at one side of the layer 4 is connected electrically to the layer 10 via a conductor connection part 11. This reduces both the resistance value of the lead wire and the heating value. At the same time, the heat dissipating performance is improved at a conduction part. |
