| 摘要 |
PURPOSE:To enhance the effect of protection of IC chips by coating the input and output terminals with a cover sheet made of thermoplastic synthetic resin almost equal in its thickness to the input and output terminals forming fixable through holes and by welding them by giving heat and by applying pressure. CONSTITUTION:In terms of an IC card, a surface side card substrate 2 and a rear side card substrate 3 are placed by holding a central flexible substrate 1 between them and welded into a solid construction by heat and pressure. Rectangular input and output terminals 6 are set on a conductor pattern 1a of a flexible substrate 1. The thickness of these input and output terminals 6 is almost the same as that of the surface card substrate 2. The surface side card substrate 2 and rear side card substrate 3 are both made of thermoplastic synthetic resin of electric insulation such as polyvinyl chloride resin. Through holes 2a capable of fitting in the input and output terminals 6 are drilled in a position corresponding to the input and output terminals 6 of the flexible substrate 1 on the surface side card substrate 2. |
