| 摘要 |
PURPOSE:To enhance reliability of electric connection by forming a conductor pattern with a mixed material of synthetic resin having a natural affinity for synthetic resin card materials with electric conductive metallic poweder. CONSTITUTION:An IC card is buried in an insulated substrate 9 made of polyvinyl chloride resin doubled as a rear cover sheet so that the upper surfaces of IC chips 10 and 11 may be arranged on the same level. Simultaneously, a conductor pattern 9a and input and output terminals 9b are formed on the surfaces thereof, and a surface cover sheet 12 made of polyvinyl chloride resin are heated and adhered so that the tip of the input and output terminals 9b may be exosed from a penetrated hole 12a on the upper surface thereof. The conductor pattern 9a can be formed by a thick membraneous method through a use of electric conduction ink in which polyvinyl chloride resin and electric conductive metalic powder such as tungsten, molybdenum are dispersed in the fluid medium. |
