发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the attaching of poor plating to the outside of a molding area exceeding the bonding area of leads effectively, by providing blocking bodies for preventing outflow of plating liquid at a boundary part between a plated area and a non-plated area of each lead part. CONSTITUTION:A lead frame is located in the inside of a molding area 6. Protruded blocking bodies 8 are provided at the outside of a plated area as a blocking body for preventing the outflow of plating liquid. Owing to the presence of the blocking bodies 8, the outflow of the plating liquid to the outside of the molding area 6 is effectively prevented in a plating process. Bridges are hooked between the neighboring leads as the blocking bodies 8 so as to prevent the outflow of the plating liquid. In this case, it is necessary to cut and remove the blocking bodies by stamping and the like.
申请公布号 JPS60208849(A) 申请公布日期 1985.10.21
申请号 JP19840065315 申请日期 1984.04.02
申请人 DAINIPPON INSATSU KK 发明人 YAMADA TSUNEHARU
分类号 H01L23/50;H01L21/60;H01L23/495 主分类号 H01L23/50
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