| 摘要 |
PURPOSE:To wipe away the excess solder sticking to a chip coil by moving relatively the surface to be stuck with the solder and a wiping member in the direction intersecting with the longitudinal direction of the wiping member. CONSTITUTION:The chip coil 1 is held to the top end of a chuck 36 and a cup- shaped solder tank 37 is moved in the direction A to stick the solder on the surface to be stuck of the coil 1. The solder removing device is thereafter moved in the arrow X direction right after the tank 37 is moved in the direction A. The excess solder sticking to the coil 1 is wiped away by a wiping part 22. |
