| 摘要 |
PURPOSE:To prevent generation of an unsatisfactory wire bonding by a method wherein the circumferential region of an alignment key is surrounded by a layer of different color having the reflection factor dissimilar to a lead. CONSTITUTION:An insulating layer is formed before a conductive layer for a lead 3 will be formed on a substrate 1. Said insulating layer has the reflection factor markedly different from that of the substrate having the color different from the substrate such as black, brown or blackish brown, for example. Then, a patterning is performed on leads 3 and 3A in such a manner that an insulating film 7 will be exposed on the circumferential region including the lead 3A and an alignment key 6. When the semiconductor chip 2 formed as above is going to be positioned, as the circumferential region of the alignment key 6 is surrounded by the insulating layer 7 of different color, the erroneous recognition of the alignment key performed using a pattern recognition device can be completely prevented. |
