摘要 |
PURPOSE:To automate the assembly by forming at least two positioning holes in a solid-state image pickup element package, and thus easily obtaining the size precision of an optical axis, a swing, etc., during an assembling process. CONSTITUTION:The CCD package 5 is made of ceramic so as to improve the position precision stably, and a CCD chip 12 is die-bonded to the metallized layer on the bottom surface of a recessed part formed in the center of the package; and a color separation filter 13 is laminated thereupon, its front surface is covered with seal glass 14, and a screw hole 16 and positioning holes 17 and 17' are bored at a left and a right side part. A pin indicating a reference position is inserted into those positioning holes 17 and 17' to specify the X- and Y-directional positions of the CCD chip 12, and the CCD package 5 is fitted to the CCD unit 1 on the basis of positioning holes 17 and 17' to easily obtain the size precision of the optical axis and swing during the assembling process.
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