发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To automate the assembly by forming at least two positioning holes in a solid-state image pickup element package, and thus easily obtaining the size precision of an optical axis, a swing, etc., during an assembling process. CONSTITUTION:The CCD package 5 is made of ceramic so as to improve the position precision stably, and a CCD chip 12 is die-bonded to the metallized layer on the bottom surface of a recessed part formed in the center of the package; and a color separation filter 13 is laminated thereupon, its front surface is covered with seal glass 14, and a screw hole 16 and positioning holes 17 and 17' are bored at a left and a right side part. A pin indicating a reference position is inserted into those positioning holes 17 and 17' to specify the X- and Y-directional positions of the CCD chip 12, and the CCD package 5 is fitted to the CCD unit 1 on the basis of positioning holes 17 and 17' to easily obtain the size precision of the optical axis and swing during the assembling process.
申请公布号 JPS60207108(A) 申请公布日期 1985.10.18
申请号 JP19840063818 申请日期 1984.03.31
申请人 SONY KK 发明人 OGAWA YOSHIHISA
分类号 H04N5/225;G02B7/00;H04N5/335;H04N5/372 主分类号 H04N5/225
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