发明名称 IMAGE FORMATION
摘要 A positive photoresist is electrodeposited onto a substrate, exposed to actinic radiation in a predetermined pattern, and then exposed areas are removed by contact with a developer. When the substrate is a metal-faced laminate, the exposed metal surface may be etched and the residual electrodeposited layer removed by contact with a suitable solvent, optionally after a second, general, exposure to actinic radiation. Suitable electrodepositable positive photoresists include o-nitrocarbinol esters and o-nitrophenyl acetals, their polyesters and end-capped derivatives and quinone diazide sulphonyl esters of phenolic novolaks, having salt-forming groups in the molecule, especially carboxylic acid and amine groups. The process is suitable for the production of printing plates and printed circuits, especially circuits on both sides of a liminate sheet linked conductively through metal-lined holes in the sheet.
申请公布号 JPS60207139(A) 申请公布日期 1985.10.18
申请号 JP19850045713 申请日期 1985.03.07
申请人 CIBA GEIGY AG 发明人 KURISUTOFUAA JIYOOJI DENMAA;EDOWAADO AABINGU;EBARUTO ROOZERUTO
分类号 C09D5/44;G03C1/72;G03C5/00;G03F7/00;G03F7/004;G03F7/022;G03F7/023;G03F7/039;G03F7/16;G03F7/26;H01L21/027;H01L21/30;H05K3/06;H05K3/44 主分类号 C09D5/44
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