| 摘要 |
PURPOSE:To improve heat-dissipation characteristics while facilitating handling by making the thickness of a resin sealing section for a lead thicker than the outside of a resin in a resin seal type semiconductor device. CONSTITUTION:A stepped beltlike metallic material is press-worked or etching- worked, and the thickness of frame plates of an island section 1' and internal lead sections 2' in a lead frame is made thicker than external lead sections 3'. The occupying ratio of the metallic material in a section sealed with a resin 6 is increased, and a heat-dissipation effect and the tensile strength of leads can be improved. Since the thickness of the external lead sections 3' is thin, the leads are bent easily on mounting to a printed board, and handling property is not deteriorated. |
