| 摘要 |
PURPOSE:To prevent a gap between upper and lower metallic molds as well as a burr in a formed product from happening by a method wherein, in resin sealing metallic molds of a semiconductor product, a post provided in the guide of lower mold is depressed into the lower mold during molding operation. CONSTITUTION:A bush 34 is fixed to an upper mold base 31 while another bush is mounted in the hole 35 of lower mold 32 to make a post 37 free-slide up and down. The top end of spring 39 abuts against the bottom end of post 37 to lift the post upward. In the molding process, the upper and lower molds are aligned by means of inserting the tapered surface of post 37 into the tapered surface of bush 34 before the opposite surfaces B of upper and lower molds come into contact with each other. When both metallic molds are pressurized to make the opposite surfaces B come into contact with each other, the post 37 is depressed into the lower mold base 32 against the elastic energy of spring 39 for molding operation. Through these procedures, any gap between the upper and lower metallic molds may be prevented from happening since the overall molding forces are exerted on the opposite surfaces B with the guide of lower mold having no influence upon the molding operation. |
