| 摘要 |
1. A mounting support for an integrated circuit housing, with output connections around the housing perimeter bent back under the body of the housing, on an electronic circuit which is constituted on the one hand of an insulating substrate bearing metallic interconnection strips on which the housing is fixed through its output connections welded thereto, and on the other hand of a metal element which ensures the double role of a mechanical stiffener for the interconnection support and of a dissipator of heat released from the integrated circuit during operation, this support being characterized in that the metallic dissipator element (12) comprises a thermal drain (11) constituted of a projection which extends through an opening (14) in the insulating interconnections support (2) and which is applied and resiliently fixed to the dissipator element, the lateral dimensions of this projection corresponding to those of the thermal drain, the height of this projection being approximately equal to the thickness of said insulating interconnections substrate (2) and its lateral dimensions corresponding to the lateral dimensions of the housing (1) in such a way that a mechanical and thermal contact with the lower face of the housing is ensured without touching and shortcircuiting the output connections (4) around the perimeter of the housing. |
