| 摘要 |
In a flip chip bonding operation, a chip (1) is required to be accurately aligned over a pattern of electrical connector pads (5) on a substrate body (7). Electrical connections between the chip (1) and the pads (5) on the body are formed by solder bumps (3) which are fused to make the connections permanent. The method of the invention provides means for accurately aligning the chip (1) by using surface tension forces which arise in the solder portions when these are fused. A solder bump (3) having a diameter of at least 40 micrometres provides adequate force for the alignment and it allows solder bonds having a lesser diameter to be accurately aligned between the two components. The method can also be used to align the components of an optical device. |
