| 摘要 |
PURPOSE:To obtain a laminated board having excellent moldability and high heat resistance and free from warpage, by impregnating a large amount of epoxy resin in a nonwoven glass cloth substrate, and combining the resultant prepreg with a glass cloth prepreg. CONSTITUTION:An epoxy resin composition having a solid resin content of >=75wt% is impregnated in a nonwoven glass cloth substrate, and the resultant prepreg is combined with a glass cloth prepreg to obtain a laminated board. The thickness of the former prepreg after the hot-pressing is 0.75-1.2 times the thickness of the substrate prior to the impregnation with the resin. When the epoxy resin is liquid at normal temperature, the impregnation can be carried out at an extremely low viscosity even at a solid resin content of as high as >=75%. |
