Self-aligned manufacture of FET

摘要

This specification discloses a self-aligned manufacturing method of a Schottky gate FET. This method comprises the steps: forming a gate metallic layer on a semiconductor substrate and a mask overhanged on the metallic layer; ion-implanting impurity ions into the semiconductor substrate using the mask to form a source/drain region; depositing an insulator on the gate metallic layer side surface and the other surface below the mask; directionally etching said deposited insulator using the mask to expose the source/drain region; depositing a source/drain electrode using the mask; and removing the mask.