发明名称 Process for the laser soldering of flexible wiring
摘要 A method for laser soldering of soldered connections of flexible wiring, which are provided at their contact points with a flux. The parts to be joined are held together by a clamp made of translucent material. The transmission of heat for the soldering process is provided by a non-contact laser beam. When the laser beam is applied the solder on both strip conductors melts. Upon removing the heat source the connection hardens to a solid solder joint.
申请公布号 US4547652(A) 申请公布日期 1985.10.15
申请号 US19830560776 申请日期 1983.12.12
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 RAISIG, HERMANN;UNGER, GREGOR;WIRBSER, OSCAR
分类号 H05K3/34;B23K1/005;B23K26/00;B23K26/20;B23K26/32;H01R43/02;H05K3/36;(IPC1-7):B23K26/00 主分类号 H05K3/34
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