发明名称 |
Process for the laser soldering of flexible wiring |
摘要 |
A method for laser soldering of soldered connections of flexible wiring, which are provided at their contact points with a flux. The parts to be joined are held together by a clamp made of translucent material. The transmission of heat for the soldering process is provided by a non-contact laser beam. When the laser beam is applied the solder on both strip conductors melts. Upon removing the heat source the connection hardens to a solid solder joint. |
申请公布号 |
US4547652(A) |
申请公布日期 |
1985.10.15 |
申请号 |
US19830560776 |
申请日期 |
1983.12.12 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
RAISIG, HERMANN;UNGER, GREGOR;WIRBSER, OSCAR |
分类号 |
H05K3/34;B23K1/005;B23K26/00;B23K26/20;B23K26/32;H01R43/02;H05K3/36;(IPC1-7):B23K26/00 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|