| 摘要 |
PURPOSE:To realize the correct state of joining without generating cracks in a semiconductor chip by lowering the hardness of a copper wire by heating the nose section of a capillary chip when the wire is jointed with an electrode. CONSTITUTION:In an ultrasonic combination thermocompression bonding type ball bonding consisting of a copper wire 1, an aluminum electrode 2, a semiconductor chip 3, a lead 4, a ball bonding section 5 and a stitch bonding section 6, the nose section of a capillary chip 7 is heated at 100-150 deg.C by a heater 10. Accordingly, the strength and hardness, of the copper wire 1 is lowered through heating, and cracks are hardly generated in the semiconductor chip, thus enabling the use of the copper wire in place of a gold wire. |
