发明名称 BINDER FOR PASTE SOLDER
摘要 PURPOSE:To improve the characteristics required for a binder by combining a prescribed weight % of an org. gelling agent with a specific % of acrylic resin and mineral turpentine. CONSTITUTION:The compsn. consisting of 25-50% acrylic resin powder, 1- 2.5% org. gelling agent and the balance mineral turpentine is mixed and agitated, then the mixture is heated in a hot bath for 1hr at about 85 deg.C. The mixture is then allowed to cool down to an ordinary temp., by which the agar-like binder is obtd. The paste solder obtd. by mixing and agitating such binder for paste solder and solder powder obviates sepn. and corrosion of the solder powder during storage and obviates generation of residues in the base metal to be brazed. The characteristics required for the binder are improved by the above- mentioned method.
申请公布号 JPS60203391(A) 申请公布日期 1985.10.14
申请号 JP19840057732 申请日期 1984.03.26
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 SHIMADA TAKAYA
分类号 B23K35/22;B23K35/36;C09D191/06;C09J133/04 主分类号 B23K35/22
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