| 摘要 |
<p>PURPOSE:To prevent the generation of exfoliation or positional discrepancy of element of small pieces when a semiconductor wafer is to be cut, and to enable to perform sucking transportation of the wafer with favorable workability after the wafer is cut into the elements of small pieces by a method wherein the specified adhesive film is shrunk by heating after the semiconductor wafer is stuck thereto. CONSTITUTION:A supporter 3 constructing a pressure-sensitive adhesive film 2 consists of a light transmissive plastic film enabled to be shrunk by heating. To form a pressure-sensitive adhesive layer 4 using a pressure-sensitive adhesive composite, it is favorable to apply the composite thereof on the light transmissive supporter 3, and to heat as occasion demands. To fix a semiconductor wafer, the pressure-sensitive adhesive film 2 is stuck on one side of a plane jig 1 having a penetrating hole larger than the outside diameter of the semiconductor wafer at first. Then the semiconductor wafer is stuck to be fixed from the side on the opposite side from the side formed with a pattern on the pressure-sensitive adhesive layer 4 of the adhesive film exposed from the penetrating hole, and the adhesive film 2 is shrunk by heating after the wafer is stuck thereto.</p> |
