发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:The titled composition rapidly curable at high temperatures and excellent in heat resistance, prepared by mixing an epoxy resin with a combination of specified two kinds of curing agents. CONSTITUTION:The titled composition prepared by mixing (A) an epoxy resin (e.g., bisphenol A-derived epoxy resin) with (B) an S-triazine derivative of the formula (wherein R1-R6 are each H, an alkyl, hydroxyalkyl, aryl, aminoaryl, or heterocyclic group and at least one of them is a substituent other than hydrogen), e.g., 2-methylamino-4,6-diamino-S-triazine) and (C) a novolak phenolic resin, where components (B+C) are present in an amount of 0.5-1.5 equivalent per equivalent of component A, and the ratio of B/(B+C) is 0.02-0.9. By the use of the combination of components B and C in the above amounts, these components act as a curing agent and cure accelerator, respectively, so that a resin composition rapidly curable at high temperatures and excellent in heat resistance can be obtained.
申请公布号 JPS60202117(A) 申请公布日期 1985.10.12
申请号 JP19840058913 申请日期 1984.03.26
申请人 HITACHI KASEI KOGYO KK 发明人 ICHIMURA SHIGEKI;KINASHI KEIICHI;KUBO ETSUJI
分类号 C09D5/03;C08G59/00;C08G59/40;C08G59/50;C08G59/62;C08L63/00 主分类号 C09D5/03
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