| 摘要 |
PURPOSE:To enhance reliability of an iron lead frame by a method wherein an alloy metallic deposit mainly consisting of copper and zinc or copper and tin is provided on the surface of a metallic body consisting of an iron alloy or iron. CONSTITUTION:A lead frame 1 for semiconductor is constructed of an inner lead part 6 and an outer lead part 7. A Cu-Zn alloy metallic deposit 2 is provided at 3mum thickness to the lead frame 1 consisting of the 3% Cr-Fe alloy, and a partial silver metallic deposit 3 is provided at 3mum thickness to the inner lead part 6 containing a pellet fitting part (a tab part) 5. By processing in such a way, adherence of the oxide film of a copper metallic deposit, which is a primary factor to deteriorate resin sealing, can be improved remarkably even when an iron lead frame is used. |
