发明名称 FORMATION OF SPUTTERED ALLOY FILM FOR DIFFUSION JOINING
摘要 PURPOSE:To obtain a joint part having high quality with ease of operation by forming the target of a vapor depositon device using sputtering into the composite target structure consisting of an alloy member for joining and a member having the same compsn. as the compsn. of the materials to be joined thereby forming a sputtered alloy film for joining on the joint surfaces of the members to be joined. CONSTITUTION:A composite target consisting of an alloy member 8 for joining and materials 5 to be joined is used for a target 1 on a backing plate. The constituting material 3 of such target 1 is driven out by the electrons confined in the magnetic field 2 of magnets N, S and is stuck onto the joint surfaces of the materials 5 by which a sputtered alloy film 4 is formed. The films 4, 4 are brought into tight contact with each other and the materials 5, 5 are pressurized and are heated and held to and at a prescribed temp. by which the materials are diffusion-joined. The sputtered alloy film for diffusion joining is uniformly formed with good dimensional accuracy and the joint part having high quality is obtd. in short time by the above-mentioned method.
申请公布号 JPS60200960(A) 申请公布日期 1985.10.11
申请号 JP19840056086 申请日期 1984.03.26
申请人 HITACHI SEISAKUSHO KK 发明人 KATOU MITSUO;FUNAMOTO TAKAO;WACHI HIROSHI;TAKAHASHI KAZUYA
分类号 C23C14/14;B23K35/00;C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/14
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