发明名称 |
METHOD FOR PLATING ORGANIC POLYMER SHEET WITH METAL |
摘要 |
PURPOSE:To carry out uniform and satisfactory electroless plating even on an org. polymer sheet as a material on which plating is hardly deposited and to provide superior electric conductivity by irradiating plasma on the sheet before electroless plating. CONSTITUTION:The surface of an org. polymer sheet having remarkably inferior adhesive strength to plating due to lack of functional groups for chemical bonding is uniformly recessed at about 1-2mum intervals by irradiating plasma. The treated surface of the org. polymer sheet is subjected to electroless plating. Plasma is irradiated by a low temp. plasma process by which excited molecules, ions or atoms are activated by electric discharge caused by applying a strong electric field to gas under low pressure. |
申请公布号 |
JPS60200967(A) |
申请公布日期 |
1985.10.11 |
申请号 |
JP19840055445 |
申请日期 |
1984.03.24 |
申请人 |
SEEREN KK |
发明人 |
SHIODA SEIJI;TAKAHASHI KOUICHI;KANETANI YOSHIHIRO;YAMADA YOSHIO |
分类号 |
C23C18/16;C23C18/20;C23C18/22;C23C18/31;C23C18/34;C23C18/40;C23C18/44 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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